Stone, Donald S.

D.S. Stone, O.M. Suarez, and C.J. Kailhofer, Measurement of Electrical Resistivity in Materials and Alloys using Commercial Data Acquisition Software, Journal of Materials Education 20(5&6) (2000) 341-356.
K.A. Dunn, S.E. Babcock, D.S. Stone, R.J. Matyi, L. Zhang, and T.F. Kuech, Dislocation Arrangements in a Thick LEO GaN Film on Sapphire, MRS Proceedings (1999).
A.A. Elmustafa and D.S. Stone, Indentation Size Effect: A Kinetic Perspective, Submitted to Advanced Materials for the 21st Century: The 1999 Julia Weertman Symposium (Y.-W. Chung, D.C. Dunand, P.K. Liaw, and G.B. Olson, eds.). TMS, Warrendale PA (1999) 311-321.
P.M. Buechner, D.S. Stone, and R.S. Lakes, Viscoelastic Behavior of Superplastic 37 wt% Pb-63 wt% Sn over a Wide Range of Frequency and Time, Scripta Materialia 41 (1999) 561-567.
M.F. Tambwe, D.S. Stone, A.J. Griffin, H. Kung, Y. Cheng Lu, and M.A. Nastasi, Haasen Plot Analysis of the Hall-Petch Effect in Cu/Nb Nanolayer Composites, J. Mat. Res. 14 (1999) 407-417.
K.B.Yoder, D.S.Stone, J.C.Lin, and R.A.Hoffman, Indentation Creep of Molybdenum: Comparison Between Thin Film and Bulk Material, in Thin Films, Stresses and Mechanical Properties V, Eds. S. P.Baker, P.Borgesen, P.H.Townsend, C.A.Ross, and C.A.Volkert, Materials Research Society, Pittsburgh, PA, 651-656 (1995).
D.S.Stone, Elastic, Transversely Isotropic Film Indented by Punch; Application to Multilayered Thin Films, in Thin Films, Stresses and Mechanical Properties V, Eds. S.P.Baker, P.Borgesen, P.H.Townsend, C.A.Ross, and C.A.Volkert, Materials Research Society, Pittsburgh, PA, 687-691 (1995).
D.S.Stone and K.B.Yoder, Division of the Hardness of Molydenum into Rate-Dependent and Rate-Independent Components, Journal of Materials Research, 9 (10), 2524-2533, (1994).
S.M.Lee and D.S.Stone, Grain Boundary Sliding in As-Cast Pb-Sn Eutectic, Scripta Metallurgica et Materialia, 30 (9), 1213-1218, (1994).
D.S.Stone and M.Rashid, Constititutive Models, The Mechanics of Solder Alloy Interconnects, 87-157, Eds. D.Frear, S.Burchett, H.Morgan, and J.Lau, Van Nostrand-Reinhold, NY, (1994).

Selected Awards, Honors and Societies

Member of TMS, MRS, and ACERS.

Summary

I investigate the mechanical properties of solids, specifically plastic flow and rupture, relating these phenomena to their underlying, atomic-scale physical mechanisms. In one project, I examine the physics of strengthening in thin (<1mm) metal films on substrates for applications, e.g., as hard coatings or as metallizations on semiconductors. Sensitive, nanometer-scale indentation techniques are used to characterize the rate- and temperature-dependence of the flow stress. In another project, I examine, in situ, how cracks initiate and propagate along the grain boundaries of solder alloys during fatigue; application of this work targets the design and performance of microelectronic packages.

In all of these studies, combining both experiments and theory, the emphasis is on how the mechanical responses of fine-scale structures can be compared and contrasted with those of bulk materials.

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Date last modified: 26-Nov-2002
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