MS&E 435: Joining of Materials: Structural, Electronic, Bio and Nano Materials

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MS&E 435 - Joining of Materials: Structural, Electronic, Bio and Nano Materials

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Catalog Description

435 Joining of Materials: Structural, Electronic, Bio and Nano Materials. II. 3 cr. Crosslisted with ME 435. Structural (metallic, ceramic, plastic, composite): welding, soldering, brazing, diffusion bonding, adhesive bonding. Electronic: wave and reflow soldering; wire, flip-chip and wafer bonding. Bio: hip and knee implants; dental restorations and implants; medical devices. Nano: nano tubes; wires; fibers and composites. P: MS&E 350 or MS&E 351 or consent of instructor. Not open to freshmen.

Course Prerequisite(s)

See catalog description above.

Prerequisite knowledge and/or skills

Chemistry
Physics

Textbook(s) and/or other required material

Course manual "Joining of Materials: Structural, Electronic, Bio and Nano Materials" consisting of slides and a textbook, prepared by S. Kou

Course objectives

To help students understand the chemical, physical and engineering principles of the joining of engineering materials
To help students understand the advantage and disadvantage of each process, and to help them select or design proper processes for joining various materials

Topics covered

Metallic materials (aluminum, steel, and stainless steel): arc, laser-beam, electron-beam, resistance and flash welding; friction, friction-stir, ultrasonic, roll and explosion welding; soldering; brazing; diffusion bonding; adhesive bonding
Plastic materials (thermoplastics and thermosets): adhesive bonding and solvent joining; hot-tool, hot-gas, extrusion, laser, implant-induction and implant-resistance welding; ultrasonic, vibration and spin welding
Ceramic materials (ceramic-to-ceramic, ceramic-to-metal, and glass-to-metal joining): brazing; diffusion bonding, ceramic frit sealing; friction welding; thermal spraying
Composite materials (metal-, ceramic and polymer-matrix composites): friction and friction-stir welding; brazing; diffusion bonding; adhesive bonding
Electronic materials (through-hole and surface-mount devices on printed circuit boards, and wafers): wave soldering, reflow soldering; wire bonding; flip-chip bonding; wafer bonding
Bio materials (dental implants, orthopedic implants and medical devices): chemical bonding; sintering; thermal spraying; ion implantation
Nano materials (nano tubes, wires and fibers): laser; electron microscope; atomic force microscope

Class/laboratory schedule

class schedule: 3 hours/week
2 to 3 labs: hands-on experience, no reports required

Contribution of course to meeting the professional component

This course contributes primarily to the students' knowledge of engineering topics, but does not provide design experience.

The following statement indicates which of the following considerations are included in this course: economic, environmental, ethical, political, societal, health and safety, manufacturability, sustainability.

economic environmental health and safety manufacturability

Relationship of course to undergraduate degree program objectives and outcomes

This course primarily serves students in the department. The information below describes how the course contributes to the undergraduate program objectives.

Ability to apply knowledge of chemistry (chemical reactions), physics (arc, laser) and engineering (concepts of fluid flow, heat transfer and mass transfer) to joining of engineering materials [ABET:3a] Ability to select or design processes that produce joints of desired properties and performance [ABET:3c] Ability to identify joining related problems and formulate plans to solve them [ABET: 3e] Ability to use modern materials joining techniques, e.g., laser beam, electron beam, laser-arc hybrid, friction stir welding to join conventional and advanced materials [ABET: 3k] Understanding of the professional and ethical responsibilities in the context of materials joining, e.g., health problems from inhaling fumes during arc welding and using lead- or cadmium-containing solders [ABET: 3f] Understanding the impact of materials joining on society and environment, e.g., welding in transportation, dental and hip implants [ABET: 3h] Understanding the need for continuing education in materials joining, which advances constantly [ABET: 3i] Knowledge of contemporary issues in materials joining, e.g., future trends in materials joining [ABET; 3j]

Assessment of student progress toward course objectives

Two mid-term exams and a final exam each consisting of two parts to evaluate students': (1) understanding of the chemical or physical principles of the processes covered, and the advantage and disadvantage of each process, and (2) ability to select or design proper processes in order to produce joints of desired needs.
Homework

Person(s) who prepared this description

Sindo Kou

Copyright 2007 The Board of Regents of the University of Wisconsin System
Date last modified: 04-Aug-2007
Content by: kailhofer@engr.wisc.edu
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