Facilities for this type of preparation are extensive and include: mounting, grinding, and polishing equipment; a jet electro-polishing instrument; dimple grinders and two ion thinning devices; vibratory polisher; and low-speed diamond saw and microtome.

Copyright 1996 The Board of Regents of the University of Wisconsin System Date last modified: 30-Sep-96 15:58:56 Content by: vanderby@ortho.wisc.edu Accessibility Web services