This course addresses the basic chemical and physical techniques used in the modern processing of materials at the micro and nanoscales particularly in the microelectronics industry. Simple device concepts are developed and used to relate the influence of the process technology to the device fabrication and materials characteristics. The relation between the properties of a deposited thin film and the deposition process is developed. The underlying physical and chemical features common to many of these processes is emphasized. While focusing on techniques used for the development of both Si and compound semiconductor-based technologies, the use and extension of these processing techniques to other types of materials is developed.

3 50-minute lectures, MWF 9:45-10:45

The following statement indicates which of the following considerations are included in this course: economic, environmental, ethical, political, societal, health and safety, manufacturability, sustainability.

This course uses the chemistry, science, and engineering fundamentals from earlier classes to analyze and understand the process-property relationships involved in electronic materials processing. The course serves as an introduction to the use of these materials and the application of basic chemical engineering principles to the solution and design of these adavnced processes.