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WestBond 747677 Aluminum Wedge Bonder

Operating procedures are available.

WestBond 747677 Aluminum Wedge Bonder

Process Description:
Once a die chip has been attached to a package, wire bonding is one method of making the connection between the die and the package. Aluminum and gold are typically used as bonding wire. Bonding has three basic methods: ultrasonic, thermocompression and thermosonic. The ultrasonic method uses ultrasonic energy to attach the wire. Thermocompression uses heat and pressure to attach the wire. For thermosonic, the wire is fed through a capillary; an electrical spark melts the tip to form a ball; and then the capillary moves downward to touch the bonding pad. After pressure, the capillary moves upward release some wire and then positioned to make the second bond.

Equipment Description:
The West Bond model has been set up as an ultrasonic 45-degree wedge bonder. The ultrasonic energy attaches a 0.001" aluminum wire at room temperature. The wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The tool is guided manually by the operator using hand/eye reference to bond targets and elevations.

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Copyright 2007 The Board of Regents of the University of Wisconsin System
Date last modified: 28-Aug-2001
Date created: 28-Aug-2001
Content by: rabauer@facstaff.wisc.edu
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