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| MicroAutomation 1006 Wafer Saw |
Operating procedures are available.
Process Description:
In order to cut materials such as a silicon wafer, quartz or glass, a delicate nickel coated or resinoid blade is used in a dicing saw.
The grit size of a blade is dependent on the material being cut.
The thinner the blade, the narrower the kerf (width of saw cut) will be, but the wider the blade, the longer it will last.
Equipment Description:
The MicroAutomation 1006 is a precision saw that uses a split-image TV camera and monitor for alignment of the sample.
There are four motor-driven assemblies to control the chuck in the X, Y, Z, and Theta axes.
You must check out the saw blade and tools from Rebecca Bauer.
Blades available are:
For gallium/arsenide — Nickel 0.0008" thick with 2 micron diamond grit
For silicon — Nickel 0.002" thick with 5 micron diamond grit
For quartz — Resinoid 0.008" thick with 45 micron diamond grit
For glass — Resinoid 0.010" thick with 67 micron diamond grit
PDF version of this page.
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Copyright 2007 The Board of Regents of the University of Wisconsin System
Date last modified: 30-Oct-2001
Date created: 30-Oct-2001
Content by: rabauer@facstaff.wisc.edu
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