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K&S 4124 Gold Ball Bonder

Operating procedures are available:
Manual Z Mode
Semiautomatic Mode

CVC 601 DC Sputterer, Metals

Process Description:
Once a die chip has been attached to a package, wire bonding is one method of making the connection between the die and the package. Gold as a bonding wire is a room-temperature conductor, a heat conductor and resistant to oxidation and corrosion. Gold wire bonding has two basic methods: thermocompression and thermosonic. Basically, the gold wire is fed through a capillary; an electrical spark melts the tip to form a ball; and then the capillary moves downward to touch the bonding pad. After pressure, the capillary moves upward release some wire and then positioned to make the second bond.
Equipment Description:
The K&S Model 4124 Ball Bonder is a thermosonic unit. The bonding is done at a lower temperature with additional ultrasonic energy. The 4124 operates in two modes, a semi-automatic and manual movement of the bonding head. The unit has a 1-mil gold wire installed and is capable of a 152mm x 152mm bonding area.

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Copyright 2007 The Board of Regents of the University of Wisconsin System
Date last modified: 20-Jul-2001
Date created: 20-Jul-2001
Content by: rabauer@facstaff.wisc.edu
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