Wisconsin Center for Applied Microelectronics  
Home :
Equipment

WCAM is a cost recovery facility. Each year the Advisory Committee reviews the fee schedule and sets the recharge amount.

NAME LOCATION DESCRIPTION OPERATION MANUAL SCHEDULING
Analytical Equipment
Filmetrics F-20 Optical Reflectometer Furnace Bay X Available  
Optical microscopes Furnace, Teaching, Plasma Etch, Wet Chemistry and Lithography Bays X    
Superior AFPP 300upg Four-Point Probe Teaching Bay X X  
Tencor Alphastep 200 Profilometer Deposition Bay X Available  
Tencor FLX-2320 Thin Film Stress Measurement Furnace Bay X Available  
Assembly
Indium Evaporator Packaging Bay X X  
K&S 4124 Gold Ball Bonder Packaging Bay X Manual Z Mode
Semiautomatic Mode 		 
Karl Suss RA-120 Wafer Scribe Packaging Bay X X  
MEI-720 Die Attacher Packaging Bay X    
MicroAutomation 1006 Wafer Saw — 2 stations Packaging Bay X Available  
WestBond 747677 Aluminum Wedge Bonder Packaging Bay X Available  
Deposition
CHA-600 E-beam Evaporator, Metals Deposition Bay X Vent and Load
Changing the Crystal Sensor
First Deposition
Additional Deposition
Vent and Unload

SCHEDULE THROUGH APRIL 25, 2006

SCHEDULE APRIL 26, 2006, AND AFTER

CVC 601 DC Sputterer, Metals Deposition Bay X Loading the Substrates
Changing the 6-inch Target
Changing the 3-inch Target
Substrate Heater
Backsputter or Pre-etch
Targets 1 and 2 Operation
Target 3 Operation
Unloading the Substrates

SCHEDULE THROUGH APRIL 25, 2006

SCHEDULE APRIL 26, 2006, AND AFTER

PlasmaTherm 74 PECVD Plasma Etch Bay X X  
Telemark E-beam Evaporator, Dielectrics Deposition Bay X Available  
Dry Etch
March Plasmod Deposition Bay X X  
PlasmaTherm 74 RIE Plasma Etch Bay X Etch — Manual Mode
Etch — Automatic Mode		  
PlasmaTherm 770 ECR Plasma Etch Bay X    
PlasmaTherm 770 ICP Plasma Etch Bay X    
Samco UV-Ozone Stripper/Cleaner Deposition Bay X X  
STS Multiplex ICP Plasma Etch Bay X X
Carrier Mounting

SCHEDULE THROUGH APRIL 25, 2006

SCHEDULE APRIL 26, 2006, AND AFTER

Unaxis 790 RIE Plasma Etch Bay X    
Ion Implantation
Eaton GA-3206 200 KeV Packaging Bay X   [Contact Dan Christensen for scheduling]
Micro-Machining
Cooke Anneal Oven Deposition Bay X    
Critical Point Dryer Wet Chemistry Bay X    
EV801 Wafer Bonding Furnace Bay X    
Obducat AB NIL —2.5 Nanoimprinter Lithography Bay X      
Photolithography
Canon PLA-501 Contact Aligner, 3" wafers Teaching Bay X First Wafer without Alignment
with Alignment		  
Headway Spinner — 1800 Series Photoresist Lithography Bay X X  
Headway Spinner — General Purpose Lithography Bay X X  
Karl Suss MA6/BA6 Contact Aligner Lithography Bay X    
Karl Suss MJB-3 Contact Aligner Lithography Bay X X  
Karl Suss MJB-3 I.R. Backside Aligner Lithography Bay X X  
Teaching Lab
Chemical Bench — Corrosive Teaching Bay X    
Chemical Bench — Solvent Teaching Bay X    
Spin Coat Bench Teaching Bay X    
Wet/Dry Oxidation Tube Teaching Bay      
Thermal Processing
Aluminum Anneal Tube Teaching Bay X X  
Chemical Bench — Pre-furnace clean Furnace Bay X    
Heatpulse 610 Rapid Thermal Annealer Furnace Bay X    
Low Temperature Oxidation Tube Furnace Bay X X  
Polysilicon LPCVD Tube Furnace Bay X X  
Silicon Nitride LPCVD Tube Furnace Bay X X  
Wet/Dry Oxidation Tubes Furnace Bay X X  
Wet Chemical
Aluminum Etchant Chemical Bench Wet Chemistry Bay X    
Buffered Oxide Etch Bench Wet Chemistry Bay X    
III-V Semiconductor Chemical Bench Wet Chemistry Bay X    
KOH/TMAH Silicon Etch Bench Packaging Bay X X  
Nitride Strip Chemical Bench Wet Chemistry Bay X    
Piranha Bench Wet Chemistry Bay X    
Solvent Bench Wet Chemistry and Lithography Bays Lithography Solvent Bench
Wet Chemistry Solvent Bench		    

Most browsers can open the PDF files on this page, but if you need a free PDF viewer, please visit the Adobe Reader webpage. Please contact us for a printout or alternative format.




Copyright 2007 The Board of Regents of the University of Wisconsin System
Date last modified: 10-Jul-2007
Date created: 03-Feb-2003
Content by: rabauer@facstaff.wisc.edu
Accessibility

Web services
Thank you for visiting http://www.engr.wisc.edu/centers/wcam/equipment.html