WCAM Materials List

 

The following list includes chemicals and materials that have been approved for use in Wisconsin Center for Applied Microelectronics.

 

 


1, 2-Dichlorobenzene, anhydrous, 99%

4-Methyl-4-acetoxycalix(6)arene

(6,6)-Phyenyl C61 butyric acid methyl ester (PCBM)

 

A

acetic acid

acetone

Adhesion Promoter AP3000

Adhesion Concentrate QZ 3289

Aluminum

Aluminum fluoride

Aluminum Etchant Type A

aluminum oxide

ammonia, anhydrous

ammonium fluoride

ammonium hydroxide

Apiezon Grease AP100

Apiezon Wax L

Apiezon Wax W

Argon

Arsenic pentafluoride (Mathison SDS)

 

B

Benzotrianrole

Biphenyl (part of polymer solution)

Boron A Boron Spin-on Dopant

boron trichloride

Boron trifluoride (Mathison SDS)

Buffered Oxide Etchants (BOE)

 

C

Calcium fluoride

carbon/graphite (crucibles)

carbon dioxide (CO2)

chlorine

chlorobenzene

chromium

Chromium Etchant 1020

Chromium Etchant CEP-200

Chrominum Etchant CR-7

cobalt

copper

Copper Etchant APS

Crystal Bond 509

CycloteneÒ 3022-46 advanced
electronics resin

 


D

defreckling aluminum etch

diffusion pump fluid DC704Ò

diffusion pump fluid Santovac 5

developer AZ 327 MIF

developer AZ 726 MIF

developer AZ 400K

developer AZ 400K diluted 4:1

developer AZ(R ) 300 MIF

developer PA-401D (replaces DE6180)

developer MF-321

developer MF-CD-26

developer NANO MIBK/IPA Series

developer SU-8

developer Polyimided RI9180

dichloromethane

dichlorosilane

DOWTHERMÒ SR-1 Heat Transfer Fluid

 

E

EC solvent 11

Edge Bead Remover – NANO EBR-PG

EDTA 50% w/v (sodium hydroxide)

EPO-TEK 301, Part A (epoxy)

 

F

Fomblin®

forming gas (see Hydrogen Mixture)

 

G

gold

gold-germanium

Gold Etchant Type GE-8111

Gold Etchant Type GE-8148 & GE-8110

 

H

Halocarbon 14 (CF4)

Halocarbon 23 (CHF3)

Halocardon C318

Helium

Heptane (part of solution)

Hexamethydisilazane

Hexane

Hydraulic oil for Obducat Imprinter – Shell Tellus Oil TX 46

hydrochloric acid

hydrofluoric acid, 49%

hydrofluoric acid, diluted 50:1

hydrogen

hygrogen mixture (H2 in N2)

hydrogen peroxide

 

I

indium

indium tin oxide coated aluminosilicate glass slide, 5-15 ohm/sq surface

indium tin oxide coated PET sheet

inert (I) gas purifier media

iron evaporation pellets

isopropyl alcohol

 

L

Lo-Na Hand Soap

 

M

manganese

methane, compressed gas

methanol

methyl methacrylate, 99%

MF-321 Developer (developers)

mr-I 8000 Series (polymersolution for Nanoimprinter)

 

N

Nickel

Niobium metal

nitric acid

nitrogen, compressed gas

nitrous oxide, compressed gas

Norland Optical Adhesive 73

NovaClean Floor Cleaner

 

O

OmniCoat (SU-8 adhesion)

oxygen, compressed gas

 

P

Permavis 8 (vacuum pump oil)

15% phosphine in 85% silane, compressed gas

phosphorous acid

Phosphorus Trifluoride (Mathison SDS)

Photomask Cleaning Solution PCS-605

photoresist AZ P4620

photoresist AZ 5214-E IR

photoresist AZ NLOF 2070

photoresist LOR A Series

photoresist MMA(8.5)MAA Copolymer Series

photoresist S1805

photoresist S1813

photoresist S1827

photoresist SPR 220

photoresist SPR 505A

photoresist STR 1045

photoresist SU-8 Series

photoresist SU-8 2000 Series

PMMA 495

Poly (3-Hexylthiophene-2, 5-DIYL), Regioregular

Poly (dimethylsiloxane) (part of solution)

Poly (DL-Lactide)

Poly (DL-Lactide-CO-Glycolide)

Polyimide Coating HD-4110 (replaces PI2525)

Polyimide Coating PI2556

Polyimide Coating PI2611

Polyimide Coating PI2721

Polyimide Coating PI2732

Polyimide Durimideä 284

Polyimide Rinser PA-400R

Positive Photoresist Stripper/Remover PRX™ 127

platinum

potassium hydroxide

ProTEKÔ B1-18

ProTEK Ô Primer

Pyralin Polyimide Coating PI-2556

 

R

Remover AZ KWIK Strip

Remover 1165

Remover PG

 

S

Silane

silicon

silicon dioxide

silicon monoxide

silicon nitride

silicon tetrahydride (silane)

silicone elastomer

silicone elastomer curing agent

silver

silver paint

sodium hydroxide

Stainless Steel Cleaner & Polish

Stripper AZ 400 T

Stripper QZ 3322

sulfur hexafluoride

sulfuric acid

Sylgard ® 186 silicone elastomer base

Sylgard ® 186 silicone elastomer curing agent

 


T

Tantalum

Tetramethylammonium hydroxide (25%)  TMAH

Thermal H5S (Julabo chiller)

Thermal HL45 (Julabo chiller)

Thermal HL80 (Julabo chiller)

Thinner Type P

Tin (Sn)

titanium

titanium oxide

TKO FF (vacuum flushing fluid)

Toluene

TRANS-LC ® (trans 1,2-Dichloroethene)

trifluoromethane

tungsten

 

V

vacuum pump fluid (see TKO FF)

vacuum pump oil (see Fomblin)

vacuum pump oil (see Permavis 8)

VM-651 (solvent for PI-2556)

 

Z

zinc oxide

 

 

 

 

 

 


 

 

 

Contact:  Rebecca Bauer, rabauer@facstaff.wisc.edu

Date created:  26 March 2009

Date last modified:  4 May 2009